SummaryThe mechanism for the adhesion of electroplate to polypropylene is partly mechanical and partly chemical. Excavation of the surface is controlled by the additives or modifiers in the polymer and the composition of the etching acid. Chemical groups are responsible for binding tin at the sensitization stage. Oxidation which occurs at the metal interface after plating provides chemical bonding. This oxidation continues and in the case of electroless copper ultimately leads to a fall in adhesion which can be minimized by using a properly stabilized composition. Nickel plate retains its adhesion for a longer time than copper on ageing at 70°C.
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L. E. Perrins (1972) studied this question.
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