Effect of the cross‐linking process on the electrical resistivity and shape‐memory behavior of cross‐linked carbon black filled ethylene‐octene copolymer

The electrical resistance of carbon black (CB) filled ethylene‐octene copolymer (EOC) was monitored during the compression molding step by means of conductivity sensors. It increases strongly during the cross‐linking process due to the de‐agglomeration of CB aggregates. After completion of cross‐linking reaction CB aggregates reagglomerate causing a decay of resistance. The electrically stimulated shape‐memory (SM) behavior was found to be strongly dependent on the extent of electrical resistivity and the rigidity of CB network, which is formed during compounding and subsequent cross‐linking process. The effect of amount of peroxide and cross‐linking conditions like time and temperature on resistivity and the related SM behavior was characterized.