Thermal growth of silicon oxide films on Si in dry O₂ is modeled as a dynamical system, assuming that it is basically a reaction-diffusion phenomenon. Relevant findings of the last decade are incorporated, as structure and composition of the oxide/Si interface and O₂ transport and reaction at initial stages of growth. The present model departs from the well-established Deal and Grove framework [B. E. Deal and A. S. Grove, J. Appl. Phys. 36, 3770 (1965)] indicating that its basic assumptions, steady-state regime, and reaction between O₂ and Si at a sharp oxide/Si interface are only attained asymptotically. Scaling properties of these model equations are explored, and experimental growth kinetics, obtained for a wide range of growth parameters including the small thickness range, are shown to be well described by the model.
No takes yet. Share an insight, caveat, or question.
Almeida et al. (2000) studied this question.
Synapse has enriched 3 closely related papers on similar clinical questions. Consider them for comparative context: