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Composite thick films of YBa2Cu3O7−x and silver have been prepared on alumina substrates using a paint-on method. It is found that thick films containing greater than about 10% silver by weight have greatly reduced normal resistivities for T>Tc (onset) and significantly enhanced Tc (R=0) as compared with undoped films processed under identical conditions. These results are interpreted in terms of enhanced grain growth and an improved coupling between grain boundaries because of proximity-induced electron pairing in the silver regions.
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Miller et al. (1989) studied this question.
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