We propose a SiC trench/planar MOSFET (TP-MOS) which features a trench channel and a planar channel in one half-cell. Numerical simulations with Sentaurus TCAD have been carried out to study the proposed device architecture. Compared with traditional planar MOSFET (P-MOS), the TP-MOS has a much lowerR ONowing to the increased channel density. Unlike traditional trench MOSFET (T-MOS) which enables a higher channel density at the price of a high bottom-oxide field in the high-voltage OFF-state, the TP-MOS features bottom p-bases as in the P-MOS that protect the gate oxide from high electric field. The OFF-state oxide field in the TP-MOS is found to be even lower than the P-MOS. In addition, the TP-MOS boasts a low feedback capacitance (C ᵣₛₛ)and gate-to-drain charge (Q GD), since the coupling between the gate and the drain is suppressed by the collective effects of the top p-bases and the bottom p-bases. TheQ Gof the TP-MOS is nearly the same as the P-MOS, and is much smaller than the T-MOS. Superior figures of merit (Q G× R ONandQ GD× R ON)are achieved in the TP-MOS.
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Wei et al. (2016) studied this question.
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