A series of new acetylene‐terminated phenylquinoxaline oligomers and diacetylene compounds have been prepared utilizing 4‐(3‐ethynylphenoxy)benzil. The amorphous materials with molecular weights from 500 to 1460 exhibited softening in the 25–160°C range with a strong polymerization exotherm reaching a maximum at 270–290°C. The addition nonvolatile cure provides materials which show excellent thermoxidative stability and processability for high‐temperature matrix and adhesive resins.
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Hedberg et al. (1979) studied this question.
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