Diffusion of ion implanted aluminum in silicon carbide

Diffusion of aluminum in silicon carbide was studied by Al implantation into single crystal SiC and subsequent profile analyses by secondary ion mass spectrometry (SIMS). The bulk diffusion coefficient of Al at temperatures between 1350 and 1800 °C was determined to be D(cm2/s) = 1.3×10−8 exp (−231 kJ/mol/RT). The results were characterized by a low activation energy and a low pre-exponential constant compared with previously reported results. Dislocation enhanced diffusion was suggested from the appearance of the tails observed in the annealed concentration profiles.