A long-lived spectral hole at high temperature is observed in SrFCl:Sm. The measured hole lifetimes at 292 and 315 K are approximately 14 days and 16 h, respectively. Thermally induced hole filling is studied by using the time-decay experimental data of the hole area at different temperatures and by assuming a thermally activated process. An average thermal activation energy of 1.2 eV needed for hole filling is deduced.
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Zhang et al. (1992) studied this question.
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