It has been found in this study that the glass transition temperatures can be considered as the lowest temperature for sintering metal fine particles to obtain electro-conductive metallic layers from the differential scanning calorimetry measurement of the fine particles. Gelatin-stabilized copper fine particles could be sintered to form an electrically conductive copper layer with a resistivity of 1.9 × 10−5 Ω cm at as low as 150 °C using oxidation–reduction two-step sintering.
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Matsubara et al. (2015) studied this question.
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