In the present investigation, we report the growth of off-stoichiometric Ni-based Heusler thin films of different thickness(6-30nm) on a Si (100) substrate by RF sputtering at 300°C. We have used an indigenously prepared target comprising thin sheets of Ni, Fe and Al in specific proportions. Of all the Heusler alloys (HA), Ni2FeAl is the least researched alloy that may offer immense possibilities in developing spin-based devices. The Ni55Fe14Al31films crystallize into A2 phase as confirmed from diffraction pattern. With increase in thickness of films, surface roughness improves followed by an increase in saturation magnetization (MS). Further, we have explored the effect of Ta buffer on the static and dynamic magnetic behavior of films and compared it with unbuffered films. The Ta buffer layer significantly impacts surface morphology of the films. The in-plane magnetic hysteresis loops indicate higher MS with Ta buffer. Dynamic magnetization is probed via ferromagnetic resonance (FMR) technique over a broad band of microwave frequencies and has been quantified in terms of Gilbert damping constant (α). The Ta buffer reduces the Gilbert damping constant from 10.1 X 10-3to 8.4 X 10-3in 30 nm thick films.
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Dhull et al. (2025) studied this question.
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