Breaking the thermally induced write error in heat assisted recording by using low and high Tc materials

Heat assisted recording is believed as a key future recording technology. In the work of H. J. Richter et al. [J. Appl. Phys. 111, 033909 (2012)] it is stated that storage densities will be limited to 15–20 Tbit/in2 due to thermally induced write errors. In this letter we propose a composite structure consisting of two materials with different Curie temperatures. In this composite material the thermal write error is negligible up to areal densities of about 50-100 Tbit/in2.