We describe a two-dimensional finite element method designed to model the nucleation, growth and evolution of voids in polycrystalline interconnects. Our computations extend earlier models by accounting in detail for the effects of grain boundaries and interfaces in the solid. In particular, the model includes the effects grain boundary sliding, grain boundary diffusion, grain boundary migration and surface diffusion, as well as elastic deformation and electric current flow within the grains themselves. Front tracking and adaptive mesh generation are used to follow changes in the grain structure and void shape. The method is used to solve representative boundary value problems to illustrate its capabilities.
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Bower et al. (2007) studied this question.
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