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A microelectromechanical-system piezoelectric pressure sensor targeting hypersonic flow applications is presented. The sensing diaphragms have 500-μm diameter and are comprised of a composite stack of Si, SiO2, and AlN. This paper presents the fabrication and packaging details of the sensor and then presents test results from a Mach-6 hypersonic-flow facility, in which the prototype sensor data are compared against data from a mature commercial sensor present in the same tests. Salient hypersonic-flow features are observed in signals captured by the prototype. The package is comprised of an on-chip two-element array with 650-μm pitch, and signals from the elements captured during hypersonic-flow tests are highly correlated.
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Seo et al. (2019) studied this question.
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