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August 1, 2011Polymer-Plastics Technology and Engineering

Filling-To-Packing Switchover Mode Based on Cavity Temperature for Injection Molding

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Authors

JWJian WangJiangsu UniversityJPJun PengNingbo UniversityWYWeimin YangJiangnan University

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Cite This Study

Wang et al. (2011) studied this question.

synapsesocial.com/papers/6a92cd6a6724a03bc54f51fahttps://doi.org/10.1080/03602559.2011.578292
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Also Consider

Synapse has enriched 2 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1A Dynamic Injection-Molding Process Model for Simulating Mold Cavity Pressure Patterns1997 · 9 citations
  2. 2Application of a capacitive transducer for online part weight prediction and fault detection in injection molding2007 · 18 citations