The defects that can occur when manufacturing VLSI ICs and the faults that can result are described. Some commonly used restructuring techniques for avoiding defective components are discussed. Several defect-tolerant designs of memory ICs, logic ICs, and wafer-scale circuits are presented. Yield models for predicting the yield of chips with redundancy are introduced, and the optimal amount of redundancy is determined.>
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Koren et al. (1990) studied this question.
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