Study of the electronic trap distribution at the SiO/sub 2/-Si interface utilizing the low-frequency noise measurement

A correlation of the trap distribution at the silicon-oxide interface with the low-frequency noise measurement in MOS devices at temperatures ranging from 77 to 300 K is presented. Several devices with differently prepared gate oxides were used to study the process-induced trap distribution. Several peaks varying from sample to sample are found in a frequency index of noise spectrum versus temperature plot and are correlated with the discrete trap distribution across the bandgap of silicon. This method provides more information on traps as it circumvents the complexity of superimposing different traps which was encountered in the capacitance-voltage (C-V) method. Results, either compatible with others' work or consistent with data based on other measurements, show that the electronic trapping behavior in MOS structures is governed by two intrinsic traps located at 0.12 and 0.3 eV (both measured from the conduction band) for all kinds of oxides. In addition, dry oxidation was found to introduce an additional trap at an energy level of 0.23 eV, and annealing the gate oxide in ammonia at a high temperature (>1000 degrees C) results in an enhancement of the trap density of 0.43 eV below the conduction band edge of silicon, which was also observed in a quasi-static C-V measurement.>