High performance semi‐interpenetrating polymeric networks based on acetylene‐terminated sulfone. Part I. Cure and thermal characteristics

A series of semi‐interpenetrating polymer networks (semi‐IPN) have been prepared from acetylene‐terminated sulfone (ATS‐C) oligomer and high‐performance thermoplastic (TP) blends. The cure characteristics and thermal properties of ATS‐C and semi‐IPNs are presented in this paper. The addition of thermoplastics has no effect on the mechanism of ATS‐C cure reaction and thermal behavior of cured systems. The glass‐transition temperature (Tg) and heat distorsion temperature (HDT) of thermoplastics are remarkably decreased with adding ATS‐C. The higher the Tg and HDT of the thermoplastics, the more obvious the reduction of Tg and HDT. In the case of fully cured semi‐IPNs, the Tg and HDT value of the TP phase are higher than or equal to the Tg and HDT of pure TP. The thermal stabilities of semi‐IPNs decrease as the content of ATS‐C oligomer increases.