Editors' Choice—2.32 kV Breakdown Voltage Lateral β-Ga2O3 MOSFETs with Source-Connected Field Plate

We report on demonstrating high performance lateral β-Ga 2 O 3 metal-oxide-semiconductor field-effect transistors (MOSFETs) with source-connected field plate (FP) on a thin (150 nm) and highly Si-doped (n = 1.5 × 10 18 cm −3 ) β-Ga 2 O 3 epitaxial channel layer grown by ozone molecular beam epitaxy (MBE) on Fe-doped semi-insulating (010) substrate. For a MOSFET with a gate-drain spacing (L gd ) of 25 μ m, the three terminal off-state breakdown voltage (V BR ) tested in Fluorinert ambient reaches 2321 V. To the best of our knowledge, this is the first report of lateral β-Ga 2 O 3 MOSFET with high V BR of more than 2 kV and the highest V BR attained among all the Ga 2 O 3 MOSFETs. The breakdown voltages with different L gd from 5–25 μ m ranged from 518–2321V, with a linear trend of increasing breakdown voltage for larger spacing lateral MOSFETs. Combining with high electrical performances and excellent material properties, source-connected FP lateral β-Ga 2 O 3 MOSFET implies its great potential for next generation high-voltage and high-power switching devices applications above 2 kV.