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The enhancement of gate leakage current after exposure to ionising radiation is generally believed to be the major challenge for devices and circuits operating in harsh radiation environments. How ultra-thin gate oxides subjected to heavy ion irradiation react to a subsequent electrical stress performed at low voltages has been investigated. Even in devices exhibiting small (or even negligible) enhancement of the leakage current, the time-to-breakdown is substantially reduced in comparison with unirradiated samples due to the onset of a soft or hard breakdown, in contrast with previous results found on thicker oxides.
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Andrea Cester (2002) studied this question.
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