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Characterization of a bonding-in-liquid technique for liquid encapsulation into MEMS devices, Okayama, Yoshiyuki, Nakahara, Keijiro, Arouette, Xavier, Ninomiya, Takeshi, Matsumoto, Yasuaki, Orimo, Yoshinori, Hotta, Atsushi, Omiya, Masaki, Miki, Norihisa
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Okayama et al. (2010) studied this question.
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