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January 1, 2013ECS Journal of Solid State Science and Technology

Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects

Hideharu Shimizu Akihito Kumamoto Kohei Shima Yoshihiko Kobayashi Takeshi Momose T. Nogami Yukihiro Shimogaki

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Abstract

Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects, Shimizu, Hideharu, Kumamoto, Akihito, Shima, Kohei, Kobayashi, Yoshihiko, Momose, Takeshi, Nogami, Takeshi, Shimogaki, Yukihiro

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Shimizu et al. (2013) studied this question.

synapsesocial.com/papers/6a94f2f06c0b764b977686f6 https://doi.org/10.1149/2.029311jss

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