It has been shown that in thin SnAg3.8Cu0.7 solder samples, strain concentration in shear bands is the dominant mechanism of fatigue damage. The development of degradation results from the interplay of lattice defect accumulation and recrystallization. Localized recrystallization is assumed to enhance the lifetime of the samples. Line patterns superimposed by FIB are useful in tracking the deformation and in localizing slip planes in the solder.
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Jud et al. (2006) studied this question.
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