A new characterization tool for vertical profile measurement of high-aspect-ratio microstructures

We have developed a system for the measurement of the inner profile of high-aspect-ratio microstructures. This system uses silicon micro-probes with a sharp tip at their end and an integrated piezoresistive force sensor. The probes are 1 mm long with a cross-sectional area of 20 × 20 μm 2 , which allowed characterization of narrow and deep micro-holes having a radius as small as 40 μm. The measurement procedure utilizes an original algorithm, which prevents it from many unwanted phenomena. It is entirely automated by using a computer control.