This paper presents a substrate integrated waveguide (SIW)-based millimeter-wave E-plane band-pass filter (BPF) with multilayer Low Temperature Co-fired Ceramic (LTCC) technology. The vertical metal walls of SIW and metal fins of the evanescent waveguides are realized by closely spacing metallic via-holes. A three-order Chebyshev E-plane BPF is developed and verified by full-wave simulation. The proposed filter is fabricated using LTCC technology, and a tapered line is designed as the transition between the SIW and microstrip line. Good agreement between simulated and measured results is observed.
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Wang et al. (2010) studied this question.
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