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Chemical-vapor deposition of copper using copper (II) bis(acetylacetonate) is reported. It is shown that at 0.1 Torr and temperatures in the range of 250–350 °C, the deposition occurs only if oxygen is added in the reactor. Auger spectroscopy, x-ray-diffraction, and resistance measurements as a function of temperature lead to the conclusion that metallic copper is deposited.
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Lecohier et al. (1993) studied this question.
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