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A general design for high-bandwidth, single-mode, lossless, optical micro-circuitry with fully three-dimensional circuit paths is demonstrated. Our 3D circuit design consists of dense stacking several planar microchip layers into the 2D-3D photonic band gap heterostructures and linking them with vertical interconnects. The 3D microchip enables an extra "dimension" of up to 200 nanometer single-mode wave-guiding in each planar chip layer and 100 nanometer bandwidth chip-to-chip interconnects in a variety of 3D PBG materials, including woodpile, slanted pores, and square spiral 3D PBG materials.
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Chutinan et al. (2006) studied this question.
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