A highly efficient copper-catalyzed C sp –X (X = S, Se, Te) bond-forming reaction of terminal alkynes and diorganyl dichalcogenides has been developed. This transformation was realized through the use of copper(I) iodide as a catalyst, 4′-(4-methoxyphenyl)-2,2′:6′,2′′-terpyridine as a ligand, and K 3 PO 4 as a base. A variety of the functionalized substrates were found to react under these reaction conditions to provide products in good to excellent yields.
No takes yet. Share an insight, caveat, or question.
Movassagh et al. (2014) studied this question.