A bisphenol‐type epoxy resin cured with phthalic anhydride was filled with three types of SiO 2 (untreated, silanized and smaller particle size), CaCO 3 , dolomite and Al 2 O 3 . Also, the concentration of silica was varied. Interaction of filler and resin was estimated by measuring the glass transition temperature ( T g ) by different methods. Electron microscopy and x‐ray diffraction were used to study the structure of the boundary layer and the bulk polymer. It was found that silica forms strong bonds with the resin and that basic fillers (CaCO 3 , Al 2 O 3 ) probably affect the crosslinking process with anhydride as hardener causing lowering of T g .
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Petrovìć et al. (1988) studied this question.
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