Key Factors Controlling Camber Behavior During the Cofiring of Bi‐Layer Ceramic Dielectric Laminates

A bi‐layer low‐temperature‐cofired ceramic laminate with different dielectric constants has been used to investigate the key factors controlling camber behavior during cofiring. Camber development, which is caused by the linear shrinkage rate difference between dielectrics, becomes more significant with decreasing thickness of dielectric. No cofiring defects, such as de‐densification, de‐bonding, and channel cracks, are observed in the multilayer structure of mixed dielectric laminates. This is because of the fact that a common sintering flux is used in both dielectrics, and the sintering mismatch stress generated in the dielectric layer is less than that of sintering potential.