Low‐Fire Processing and Properties of Ferrite+Dielectric Ceramic Composite

A low‐fire Ni–Cu–Zn ferrite+dielectric ceramic composite and its multilayer integrated laminate, which can be densified at temperatures below 900°C, is prepared. To densify Ni–Cu–Zn ferrite at low temperatures, the dielectric needs to contain an effective sintering flux of Bi 2 O 3 or PbO to the Ni–Cu–Zn ferrite. This enables densification of the resulting ceramic composite or multilayer integrated dielectric/ferrite laminate at temperatures close to those of pure ferrite and dielectric. The dielectric constant decreases but the initial permittivity increases with increasing amount of ferrite existing in the ferrite+dielectric ceramic composite.