Compact flip‐chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver

The first compact electroabsorption modulators integrated with distributed‐feedback (EADFB) laser array module using flip‐chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip‐chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation.