Thin dielectric films have been produced by low energy electron bombardment of a surface which is simultaneously exposed to an evaporating epoxy resin. The rate of film growth is dependent only on the evaporation parameters when the electron flux at the surface is much larger than the molecular flux in the evaporant beam. The polymerized epoxy films are good insulators with d‐c dielectric breakdown strengths greater than 10 6 v/cm. The films are stable in normal room atmosphere and may be cycled thermally from room temperature to 77°K many times without damage to their mechanical or electrical properties. A number of multilayer electrical structures consisting of alternating evaporated Pb films and epoxy films have been prepared successfully and tested.
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Brennemann et al. (1965) studied this question.