The influence of oxygen on the wetting behavior of copper on single‐crystal Al 2 O 3 has been studied. By controlling the oxygen partial pressure ( p O2 ) and oxygen content in the copper simultaneously, contact angle can be varied between 125° and 22°. Evaluation of the Gibbs adsorption equation for the liquid/solid interface at 1300°C suggests that adsorption of a Cu‐O complex at that interface plays a key role in promoting wetting. Formation of CuAlO 2 and dissolution of Al 2 O 3 in the melt also influence the contact angle, especially in the range of p O2 > 10 −5 bar (1 Pa).
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Diemer et al. (1999) studied this question.
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