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A pseudobinary thermodynamic analysis of the alumina/copper–oxygen eutectic bonding process yields a value of approximately 1076°C for the invariant temperature of the {Cu( ss ), Cu( L1 ), CuAlO 2 , Al 2 O 3 } equilibrium. This temperature, which is 11°C above the eutectic, corresponds to a critical temperature for stability of the copper aluminate CuAlO 2 in eutectic bonding. Implications for controlling interface microstructure are highlighted.
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Kevin P. Trumble (1999) studied this question.
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