Liquid‐phase bonding of copper foils to ceramic substrates is a very attractive technique for the fabrication of metallized substrates for hybrid power electronics applications. The design and reliability considerations of such substrates necessitate the knowledge of their mechanical properties. Therefore, stresses and strains in the copper and in the ceramic of bonded substrates were investigated. Theoretical calculations are presented to support the experimental results and to find the influence of stresses and strains in the fabrication of copper ceramic substrates using the liquid‐phase‐bonding technique.
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Wittmer et al. (1982) studied this question.
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