Batch Microfabrication of Metal-Embedded Micro Thin Film Sensors for Applications in Hostile Environments

Microsensors are promising for in situ process monitoring in hostile environments. It is challenging to embed microsensors into functional metallic structures to avoid direct exposure to the harsh external environments. A technique for batch production of metal-embedded thin-film microsensors has been developed. Microsensors fabricated on a silicon wafer can be directly transferred and embedded into electroplated metal. Thin film microstrain gages were successfully fabricated and embedded into nickel. These sensors are isolated electrically from the metallic substrate and embedding layer by a dielectric multilayer. These metal embedded sensors have great potential for applications in hostile environments.