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GaN thick film is grown on NdGaO3 substrate using hydride vapor phase epitaxy. To avoid decomposition of NdGaO3 substrate by NH3, a low-temperature grown GaN protective layer is adopted. Using NdGaO3 substrate and a low-temperature GaN protective layer simultaneously, 2-inch-scale GaN wafers are realized. The photoluminescence (PL) spectrum indicates strong band-edge emission without deep-level related emission. Both plan-view transmission electron microscope and cathode luminescence images suggest that the dislocation density of freestanding GaN wafers is expected to be as low as 106 cm-2.
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Wakahara et al. (2000) studied this question.
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