Films of the organic-inorganic layered perovskite (C6H5C2H4NH3)2SnI4 were vacuum-deposited on substrates heated at various temperatures (Tsub) to investigate the influence of Tsub on their film quality and transistor performance (hole mobilities, threshold voltages, and current on/off ratios). Appropriate substrate heating at Tsub = 60 °C during vacuum deposition led to better-developed perovskite films with larger grains. These films exhibited the best transistor performance in comparison with films fabricated at the other Tsub. The transistor performance was further enhanced by reducing perovskite semiconductor thickness (t) because of a reduction of bulk resistance in a top-contact/bottom-gate transistor structure. By utilizing the optimized Tsub of 60 °C and t of 31 nm, we obtained the most improved hole mobility of 0.78 ± 0.24 cm2/V s, about 5000 times the hole mobilities of our initial transistors fabricated at Tsub = 24 °C and t = 50 nm.
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Matsushima et al. (2016) studied this question.
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