Enhanced Thermal Control via Hybrid PCM-Wavy Surface Cooling: Optimization for High-Power Electronics

Efficient thermal control of high-power-density electronic components is critical given rising demands for compact designs. This study explores a hybrid cooling system (HCS) that integrates phase change materials (PCMs), adjustable wavy surfaces (WS), and multi-mode heat transfer within a partitioned cylindrical structure: an air-filled core dissipates heat via natural convection and radiation; a surrounding PCM layer stores latent heat; and an outermost WS enclosure is cooled by forced-air jets and thermal radiation. COMSOL Multiphysics 5.6 simulations (Galerkin finite element method) evaluate impacts of emissivities (inner/outer), WS geometry (undulation count/amplitude), PCM properties (latent heat/melting point), and air-jet velocity. Key findings: Undulation amplitudes > 0.12 extend PCM melting by ~ 45 min; increased PCM latent heat/melting temperature boost heat storage by +4 h/+12 h; external emissivity reduces peak temperatures by ~ 20°C and delays melting by ~ 6 h; internal emissivity lowers temperatures by 6.6-20.8°C (minimal melting impact); and higher inlet velocity decreases peak temperatures by ~ 30°C while extending heat storage by ~ 50 min.