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The generation of interface traps by different stresses to 4-nm thick SiO/sub 2/ gate oxide is studied. Four different kinds of constant current stresses were applied. The interface-trap density (D/sub it/) generation due to hot holes under V/sub G/<0 Fowler-Nordheim (FN) stress was characterized using quantum-yield measurement and substrate-hot-hole (SHH) stress. The interface-trap density (D/sub it/) generated by SHH stress increases as gate-oxide field increases. Substrate-hot-electron (SHE) stress generates much less interface-trap density (D/sub it/) than SHH stress. It is also observed that N/sub 2/O-grown gate-oxide has smaller hole-injection probability but larger electron-injection probability than O/sub 2/-grown oxide. N/sub 2/O-grown gate oxide is shown to have less SHH stress-induced interface traps than O/sub 2/-grown oxide in p-channel metal-oxide-semiconductor field-effect transistor (MOSFET) devices.
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Shiue et al. (1999) studied this question.
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