Peristaltic electro-osmotic flow of SWCNT and MWCNT nanofluid in a curved channel with Hall current and velocity slip

This work examines the electro-osmotic driven peristaltic transportation of a nanofluid based on carbon nanotubes (CNTs) in a two-dimensional curved electro-osmotic channel under the combined effects of velocity slip, Hall current, and Ohmic heating. The electric potential within the electric double layer is described by the coupled Poisson and Nernst-Planck equations, which model the electrokinetic transport mechanism. Furthermore, the momentum and energy equations are modified to include electromagnetic body forces and Joule heating effects. The equations are governed into a simplified dimensionless form by using the long wavelength and low Reynolds number approximations, and they are then numerically solved under appropriate boundary conditions. The mathematical model equations are numerically solved using the shooting approach, and the behaviour is visually evaluated using MATLAB software. The key finding shows that when the CNTs are inserted into water, the enhancement occurs in the heat transfer rate. When CNTs are inserted into fluid, the velocity decreases due to the material's increased viscosity. The temperature and heat transmission rate are reduced in the existence of Hall effects. The presence of a magnetic field lowers the rate of heat transmission and increases the pressure gradient. The velocity rises near the wall by the higher inputs of velocity slip impact. However, the reverse behavior is seen close to the channel's midpoint. The improvement in the pressure gradient is observed due to the velocity slip parameter. The proposed model gives valuable insights into the optimization and design of electro-osmotic micropumps, bio-MEMS, targeted drug delivery systems, lab-on-chip devices, artificial physiological transport devices, microfluidic cooling technologies, artificial physiological transportation devices, and point-of-care diagnostic platforms that require exact fluid transport and thermal management.