Everyone in a position to judge recognizes the advantages of silicon-on-insulator technology-higher circuit speed, lower power consumption, greater immunity to radiation-induced errors and compatibility with existing IC fabrication processes. In the past few years, these advantages have become critical for some commercial applications, particularly in the portable electronics arena, where the pressure for lower power and higher performance is unrelenting. As companies, universities, government agencies, and consortia throughout the world address silicon-on-insulator (SOI) technology, the supply of less expensive yet high-quality SOI materials is growing, and the grasp of the fabrication process strengthening-both encouraging signs. And, as applications for the technology increase, the focus today is shifting from issues oF feasibility to issues of circuit design and yield.
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Michael L. Alles (1997) studied this question.