Optimization of the Performance of Thin-Plastering Technology for Building Exterior Wall Insulation Boards in the Low-Carbon Era

Realizing low-carbon targets is greatly impacted by the building industry, which is a major source of energy consumption and greenhouse gas emissions in the context of global climate change. Building energy consumption can be effectively decreased, and energy efficiency increased with the use of outside wall insulation technology. However, existing studies on the thermal and mechanical properties of thin plaster technology for exterior wall insulation boards are limited and lack comprehensive comparative performance analysis. Therefore, this study adopts a combination of theoretical analysis and numerical simulation to analyze the performance of thin-plastering technology for an exterior wall insulation board using COMSOL (version 6.1) software. The experimental results indicate that the thin plaster exterior wall insulation system model is superior in terms of thermal insulation performance, with a 32.85% reduction in the heat transfer coefficient at thicknesses ranging from 100 to 150 mm. The heat transfer coefficient of the thin plaster exterior wall insulation system model using extruded polystyrene material is 15.94% lower than that of the sandwich insulation system model at a thickness of 250 mm. The stress and displacement fluctuations of the thin plaster exterior wall insulation system model are large under steady-state and transient conditions. Combining the experimental results, the study suggests increasing the thickness of the insulation layer, selecting highly efficient insulation materials, optimizing the material and layout of the tie members, strengthening the bond strength, controlling the humidity, and regular maintenance. In addition to offering a scientific foundation and useful advice for achieving the energy-saving and emission-reduction objectives of the construction industry, the study advances the innovation and development of building external wall insulation technology.