FinFET With Improved Subthreshold Swing and Drain Current Using 3-nm Ferroelectric Hf 0.5 Zr 0.5 O 2

High-performance negative capacitance p-type FinFETs (p-FinFETs) with a 3-nm-thick ferroelectric (FE) hafnium zirconium oxides (Hf0.5Zr0.5O2) layer are fabricated based on a conventional high-κ metal gate FinFETs fabrication flow. The devices show improved subthreshold swing values [34.5 mV/dec for 500-nm gate length (LG) and 53 mV/dec for 20-nm-LGdevices] and slight hysteresis voltages (~9 mV for LG= 500 nm and ~40 mV for LG= 20-nm transistors). With the integrated FE film, a strong driving current enhancement (up to 260%) is also obtained compared with that of conventional FinFETs. The inherent reasons for the improved characteristics contribute to the low-interface state density (Dit) and the perfect channel electrostatic integrity.