In this article bending response of the sandwich panel with functionally graded (FG) skins under thermal and/or mechanical loading is studied. Higher order sandwich plate theory has been exploited. In addition, by using Fourier conduction equation and obtaining temperature distribution, thermo-elastic behavior of such structure is investigated. Comparison between the results of analytical and FEM solutions is indicative of robustness of the analytical solution for prediction of in-plane and out-of-plane stresses. It is shown a wise selection for FG skin materials is helpful to have better conditions under thermo-mechanical loading and to decrease the delamination failure possibility.
No takes yet. Share an insight, caveat, or question.
Sadighi et al. (2011) studied this question.
Synapse has enriched one closely related paper. Consider it for comparative context: