The ability to examine latent resist images can provide a means of separating out the influences of the exposure itself from the subsequent postexposure bake and from the development process in determining the form of the final developed image. We describe the technique of photon tunneling microscopy (PTM) and its application to examining latent resist features. The PTM is based upon the concept of frustrated total internal reflection, and can give information on latent images that is highly sensitive to both changes in topography as small as 1 nm and refractive index changes on the order of 10−2–10−3. Preliminary modeling shows how this technique can give quantitative information about the progress of the radiation induced chemistry in resist. Experimental data for two positive-tone, chemically amplified materials, ARCH2 and CAMP1 illustrate the potential of the technique.
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Liddle et al. (1997) studied this question.
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