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In-plane and out-of-plane thermal diffusivities (conductivities) of Kerimid resin composites reinforced with various types of filler were studied both experimentally and theoretically. The types of filler used are SiO 2 particle, Al 2 O 3 short fiber, Boron Nitride (BN) flake, and Si 3 N 4 whisker. The prediction based on our previous model (Eshelby's equivalent inclusion method) agreed reasonably well with the experiment, except for BN flake composite. It was found that the orientation of filler has a strong effect on the overall thermal conductivity of a composite.
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Hatta et al. (1992) studied this question.
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