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Highly ordered wavy cracks are observed in silica films deposited on crystalline Si wafer. The wavy crack path is interpreted in terms of the coupling of the in-plane film crack and the interface debonding. A model based on the analyzing of the crack path and the stress evolution is proposed to describe the propagation of the wavy cracks. A scaling relationship between the wavelength (λ) and amplitude $(A)$ is found (λ~A^ξ) and the scaling factor is determined to be ξ=0.47±0.01.
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Wan et al. (2009) studied this question.
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