In vitro corrosion of two low-copper and three high-copper dental amalgams was examined using stressed and unstressed specimens. Stress was applied in tension; anodic polarization curves and polarization resistance were determined. In stressed condition, the passive current density was higher, and polarization resistance was lower. The changes are attributed mainly to the fracture of passive films by creep strain.
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Averette et al. (1983) studied this question.
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