A Hall–Petch (H–P)-type dependence is demonstrated for reciprocal activation volume measurements for nanocrystalline and conventional grain size, strengthened Ni and Cu materials, consistent with predictions derived from the dislocation pile-up model. The observed H–P dependence indicates that the shear stress for cross-slip must be involved in the full grain size regime for transmission of plastic flow at the grain boundaries of fcc metals.
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Armstrong et al. (2006) studied this question.
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